Creative solutions to challenging micromachining problems, using precision diamond dicing blades. To cut and machine a variety of hard brittle materials. To be one of the fastest quick turn dicing. Shops in the world, filling a critical customer need for fast, high quality work. For excellence has resulted in an impressive customer base of whom it feels extremely proud. To see what we can do. 169; 2000 - American Precision Dicing, Inc.

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Its rotating distal gripping tips is a feature that allows for random access of 200mm wafers into small pitch cassette, boat or any narrow gates. Vortex and Edge Gripper for thin wafer. This vortex end effector provides superior handling of all types of wafers, including thin wafers, with no contact between the wafer and end effectors.

Wafer products Wafer machines Wafer shapes. With a focus on wafer machines. Special Machines - Wafer Products - Wafer Machines - Wafer Shapes. Lippl-Special Mechanical Engineering - Company and Office.

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